SemiQ has unveiled seven new modules in its third-generation QSiC MOSFET product line, targeting high-power industrial ...

Quobly achieves milestone in its industrial roadmap with Soitec’s 28Si FD-SOI wafers in STMicroelectronics’ 300mm fab.

China strengthens its semiconductor industry by approving domestic AI processors for official government procurement.

Nordic Semiconductor has introduced the nRF9151 SMA Development Kit for satellite and cellular IoT connectivity.

Tria Technologies has introduced two new Computer-on-Modules (COMs) under the Qseven (Q7) standard, aiming to secure the ...

HARTING has launched the Han S 450 Plus connector, designed to meet the growing demands of energy storage systems (ESS).

CEA-Leti has announced a major advance in semiconductor manufacturing, successfully fabricating fully functional 2.5 V SOI ...

Altair, now part of Siemens, has announced the release of HyperWorks 2026, its latest computer-aided engineering (CAE) ...

ByteSnap Design, the UK design consultancy, has published insights on MISRA C compliance for safety-critical software.

Molex has unveiled MX-DaSH Modular Wire-to-Wire Connectors, the latest addition to its MX-DaSH family, aimed at simplifying ...

The RA6W1 MCU supports dual-band Wi-Fi 6, while the RA6W2 combines Wi-Fi 6 with Bluetooth Low Energy (LE) connectivity. The ...

NLX, a high-standoff RF front-end protection switch designed for demanding aerospace and defence applications. New ...